The introduction of fillers into the epoxy resin can have a pronounced effect on its final properties. Depending upon the user’s unique requirements, Resdel tubing and encapsulation cups are available in a number of proprietary epoxy formulations. Standard compositions include a general purpose (unfilled) mix, 12% and 50% silicon dioxide filled systems, and a special formula used to manufacture transparent and translucent tubing.
Also available are thermally and electrically conductive grades, as well as systems designed with particular impact resistance.
Characteristics of this formulation include fair to good machinability and impact strength, along with excellent dielectric properties. Commonly used for electrical encapsulation. This is also ideal for sensor housings.
Silicon Dioxide Filler
This grade has slightly higher dielectric strength than our unfilled system, but at some loss in machinability and impact strength. The addition of the filler decreases the thermal coefficient of expansion and makes the tubing suitable for encapsulation when thermal shock tolerance is of concern. The 12% filled system is used principally to manufacture small diameter (under .250” O.D.) tubing. For larger O.D.’s, the 50% filled system should be used.
This is an unfilled resin system used to produce transparent tubing. It is also ideal for sensor housings. The formulation has fair to good machinability and good to excellent chemical resistance. Frequently used to house scientific apparatus such a pH and ion-specific electrodes.